Today we presents the Phenom II X2 550 Black Edition processor. AMD has made a successful transition to the 45nm fabrication process, giving the Phenom II series the necessary breathing room to prove it has what it takes to go head to head with the Intel Core 2 range.
The Phenom II X2 550 Black Edition is based on the exact same 45-nm Deneb core AMD uses in their latest Phenom II processors. The only difference is AMD activates two processing cores, leaving two cores disabled. Because it’s based on the same core as AMD’s other Phenom II parts, the same key architecture features carry over unchanged. The chip features 64KB of L1 cache per core for data and instructions (256KB L1 total) and 512KB of L2 cache per core for a grand total of 1MB of L2 cache active on the processor. The L3 cache carries over unchanged, with the Phenom II X2 550 Black Edition sporting 6MB of L3 cache shared amongst the processors two cores. Like all AM3 Phenom II CPUs, the chip also features a 2.0GHz memory controller.
Finally, the most important remaining spec for the Phenom II X2 550 Black Edition is its clock speed. AMD clocks the chip at 3.1GHz, which the chip featuring a 15.5x multiplier. Keep in mind that as a Black Edition CPU, the multiplier is unlocked and can be adjusted to whatever setting you wish when OC’ing AMD lists the max TDP for the Phenom II X2 550 Black Edition at 80W.
| Phenom II X2 550 Black Edition Specifications | |
| Core | Calisto |
| Clock Speed | 3.1GHz |
| L1 Cache Size | 64K of L1 instruction and 64K of L1 data cache per core (256KB total L1 per processor) |
| L2 Cache Size | 512KB of L2 data cache per core (1MB total L2 per processor) |
| L3 Cache Size | 6MB (shared) |
| Memory Controller Type | Integrated 128-bit wide memory controller *Black Edition processors support software selectable increases to memory controller, HyperTransport, DDR3 and CPU core frequency |
| Memory Controller Speed | 2.0GHz with Dual Dynamic PPower Management |
| Types of Memory Supported | Support for unregistered DIMMs up to PC2-8500 (DDR2-1066MHz) -AND- PC3-10600 (DDR3-1333MHz) |
| HyperTransport 3.0 Specification | One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz x2) |
| Total Processor-to-System Bandwidth | Up to 37.3GB/s bandwidth [Up to 21.3 GB/s total bandwidth (DDR3-1333) + 16.0GB/s (HT3)] |
| Packaging | Socket AM3 938-pin organic micro pin grid array (micro-PGA) |
| Fab location | GLOBALFOUNDRIES Fab 1 Module 1 |
| Process Technology | 45-nanometer DSL SOI (silicon-on-insulator) technology |
| Approximate Die Size | 258 mm2 |
| Approximate Transistor count | ~758 million |
| Max Temp | 70 degrees Celsius |
| Core Voltage | 0.850-1.425V |
| Max TDP | 80W |
| Distributor Pricing (in quantities of 1,000) | $102 |
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